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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/34 www.rohm.com tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 tsz22111 ? 14 ? 001 datashee t 200-ma 3.3-v or 5.0-v output ldo regulators bd4xxm2-c series general description the bd4xxm2-c series are low quiescent regulators featuring 45 v absolute maximum voltage, and output voltage accuracy of 2 % ( 3.3 v or 5.0 v: typ.), 200 ma output current and 40 a (typ.) current consumption. these regulators are therefore ideal for applications requiring a direct connection to the battery and a low current consumption. a logical high at the ctl pin enables the device and low at the ctl pin not enables the device. (only w: includes switch) ceramic capacitors can be used for compensation of the output capacitor phase. furthermore, these ics also feature overcurrent protection to protect the device from damage caused by short-circuiting and an integrated thermal shutdown to protect the device from overheating at overload conditions. packages w (typ.) x d (typ.) x h (max.) ? efj: htsop-j8 4.90 mm x 6.00 mm x 1.00 mm features ? qualified for automotive applications ? wide temperature range: -40 c to +150 c ? wide operating input range: 3.0 v to 42 v ? low quiescent current: 40 a (typ.) ? output current: 200 ma ? high output voltage accuracy: 2 % ? output voltage: 3.3 v or 5.0 v (typ.) ? enable input (only w: includes enable input) ? over current protection (ocp) ? thermal shutdown protection (tsd) ? aec-q100 qualified ? fp3: sot223-4f 6.53 mm x 7.00 mm x 1.80 mm figure 1. package outlook applications ? automotive (body, audio system, navigation system, etc.) typical application circuits ? components externally connected: 0.1 f cin, 10 f cout (typ.) *electrolytic, tantalum and ceramic capacitors can be used. f igure 2. typical application circuits 4:gnd 2:ctl 3:vout 1:vcc bd4xxm2wfp3-c cin cout bd433 / 450m2wefj-c bd433 / 450m2efj-c bd433 / 450m2wfp3-c bd433 / 450m2fp3-c htsop-j8 sot223-4f bd4xxm2efj-c 8:vcc 7:n.c. 6:n.c. 5:gnd 1:vout 2:n.c. 3:n.c. 4:n.c. cin cout downloaded from: http:///
datasheet datasheet 2/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series ordering information b d 4 x x m 2 w e f j c e 2 part number output voltage 33: 3.3 v 50: 5.0 v output current 2: 200 ma enable input w: includes enable input package efj: htsop-j8 fp3: sot223-4f packaging and forming specification e2: embossed tape and reel lineup output current ability output voltage (typ.) enable input *1 package type orderable part number 200 ma 3.3 v sot223-4f bd433m2wfp3-ce2 htsop-j8 bd433m2wefj-ce2 sot223-4f bd433m2fp3-ce2 htsop-j8 bd433m2efj-ce2 5.0 v sot223-4f BD450M2WFP3-CE2 htsop-j8 bd450m2wefj-ce2 sot223-4f bd450m2fp3-ce2 htsop-j8 bd450m2efj-ce2 *1 : includes enable input. : not includes enable input. downloaded from: http:///
datasheet datasheet 3/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series pin configurations figure 3. pin configuration pin descriptions bd433 / 450m2wefj-c bd433 / 450m2wfp3-c pin no. pin name function pin no. pin name function 1 vout output pin 1 vcc supply voltage input pin 2 n.c. not connected 2 ctl output control pin 3 n.c. not connected 3 vout output pin 4 n.c. not connected 4 (fin) gnd ground pin 5 gnd ground pin 6 n.c. not connected 7 ctl output control pin 8 vcc supply voltage input pin bd433 / 450m2efj-c bd433 / 450m2fp3-c pin no. pin name function pin no. pin name function 1 vout output pin 1 vcc supply voltage input pin 2 n.c. not connected 2 gnd ground pin 3 n.c. not connected 3 vout output pin 4 n.c. not connected 4 (fin) gnd ground pin 5 gnd ground pin 6 n.c. not connected 7 n.c. not connected 8 vcc supply voltage input pin * n.c. pin is recommended to short with gnd. * n.c. pin can be open because it isnt connect it inside of ic. * exposed die pad is need to be connected to gnd. htsop-j8 (top view) sot223-4f (top view) 123 4 (fin) downloaded from: http:///
datasheet datasheet 4/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series block diagrams bd433 / 450m2wefj-c bd433 / 450m2efj-c prereg gnd (5pin) vcc (8pin) vout (1pin) n.c. (7pin) n.c. (2pin) tsd vref driver ocp n.c. (6pin) n.c. (3pin) n.c. (4pin) downloaded from: http:///
datasheet datasheet 5/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series bd433 / 450m2wfp3-c bd433 / 450m2fp3-c figure 4. block diagrams prereg gnd (fin) vcc (1pin) vout (3pin) ctl (2pin) ctl tsd vref driver ocp prereg gnd (2pin) gnd (fin) vcc (1pin) tsd vref driver ocp vout (3pin) downloaded from: http:///
datasheet datasheet 6/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series description of blocks block name function description of blocks ctl *1 control output voltage on/off a logical high ( 2.8 v ) at the ctl pin enables the device and low ( 0.8 v ) at the ctl pin not enable the device. prereg internal power supply power supply for internal circuit tsd thermal shutdown protection to protect the device from overheating. if the chip temperature ( tj ) reaches ca. 175 c ( typ. ), the output is turned off. vref reference voltage generate the reference voltage driver output mos fet driver drive the output mos fet ocp over current protection to protect the device from damage caused by over current. if the output current reaches ca. 550 ma ( typ.), the output is turned off. *1 applicable for product with enable input. downloaded from: http:///
datasheet datasheet 7/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series absolute maximum ratings parameter symbol ratings unit supply voltage *1 vcc -0.3 to +45.0 v output control voltage *2 ctl -0.3 to +45.0 v output voltage vout -0.3 to +8.0 v power dissipation htsop-j8 *3 pd 0.75 w sot223-4f *3 pd 0.60 w junction temperature range tj -40 to +150 c storage temperature range ts t g -55 to +150 c maximum junction temperature tjmax +150 c esd withstand voltage (hbm) *4 v esd,hbm 2000 v *1 do not exceed pd. *2 applicable for product with enable input. the start up orders of power supply (vcc) and the ctl pin do not influence if the voltage is within the operation power supply voltage range. *3 htsop-j8 mounted on 114.3 mm x 76.2 mm x 1.6 mmt glass-epoxy pcb based on jedec. if ta R 25 c, reduce by 6.0 mw/c. (1-layer pcb: copper foil area on the reverse side of pcb:0 mm x 0 mm) sot223-4f mounted on 114.3 mm x 76.2 mm x 1.6 mmt glass-epoxy pcb based on jedec. if ta R 25 c, reduce by 4.8 mw/c. (1-layer pcb: copper foil area on the reverse side of pcb:0 mm x 0 mm) *4 esd susceptibility human body model hbm operating conditions (-40 c tj +150 c) parameter symbol min. max. unit supply voltage ( iout 200 ma ) *1 vcc 4.3 42.0 v supply voltage ( iout 100 ma ) *1 vcc 3.9 42.0 v supply voltage ( iout 200 ma ) *2 vcc 5.8 42.0 v supply voltage ( iout 100 ma ) *2 vcc 5.5 42.0 v output control voltage *3 ctl 0 42.0 v start-up voltage *4 vcc 3.0 v output current iout 0 200 ma junction temperature range tj -40 +150 c *1 bd433m2wefj-c / bd433m2wfp3-c / bd433m2efj-c / bd433m2fp3-c *2 bd450m2wefj-c / bd450m2wfp3-c / bd450m2efj-c / bd450m2fp3-c *3 applicable for product with enable input *4 when iout = 0 ma downloaded from: http:///
datasheet datasheet 8/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series thermal resistance parameter symbol min. max. unit htsop-j8 package junction to ambient *1 ja 43.1 c/w junction to case (bottom) *1 jc 10 c/w sot223-4f package junction to ambient *2 ja 83.3 c/w junction to case (bottom) *2 jc 17 c/w *1 htsop-j8 mounted on 114.3 mm x 76.2 mm x 1.6 mmt glass-epoxy pcb based on jedec. (4-layer pcb: copper foil on the reve rse side of pcb:74.2 mm x 74.2 mm) *2 sot223-4f mounted on 114.3 mm x 76.2 mm x 1.6 mmt glass-epoxy pcb based on jedec. (4-layer pcb: copper foil on the reve rse side of pcb:74.2 mm x 74.2 mm) downloaded from: http:///
datasheet datasheet 9/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series electrical characteristics (unless otherwise specified, -40 c tj +150 c, vcc = 13.5 v, ctl = 5 v(*1), iout = 0 ma. the typical value is defined at tj = 25 c.) parameter symbol limit unit conditions min. typ. max. shut down current ishut *1 2.0 5.0 a ctl = 0 v, tj 125 c circuit current icc 40 90 a iout = 0 ma, tj 125 c 40 150 a iout 200 ma, tj 150 c output voltage vout *2 4.90 5.00 5.10 v 6 v vcc 42 v, 0 ma iout 50 ma 4.80 5.00 5.10 v 6 v vcc 42 v, iout 200 ma vout *3 3.23 3.30 3.37 v 6 v vcc 42 v, 0 ma iout 50 ma 3.16 3.30 3.37 v 6 v vcc 42 v, iout 200 ma dropout voltage vd *2 0.16 0.35 v vcc = vout x 0.95 (= 4.75v: typ.), iout = 100 ma vd *3 0.20 0.45 v vcc = vout x 0.95 (= 3.135v: typ.), iout = 100 ma ripple rejection r.r. 55 65 db f = 120 hz, ein = 1 vrms, iout = 100 ma line regulation reg.i 10 30 mv 8 v vcc 16 v load regulation reg.l 10 30 mv 10 ma 100 ma thermal shut down tsd 175 c tj at tsd on *1 applicable for product with enable input. *2 for bd450m2wefj-c / bd450m2wfp 3-c / bd450m2efj-c / bd450m2fp3-c *3 for bd433m2wefj-c / bd433m2wfp 3-c / bd433m2efj-c / bd433m2fp3-c electrical characteristics ( enable function * applicable for product with enable input. ) (unless otherwise specified, -40 c tj +150 c, vcc = 13.5 v, iout = 0 ma. the typical value is defined at tj = 25 c.) parameter symbol limit unit conditions min. typ. max. ctl on mode voltage vthh 2.8 v active mode ctl off mode voltage vthl 0.8 v off mode ctl bias current ictl 15 30 a ctl = 5 v downloaded from: http:///
datasheet datasheet 10/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40 45 circuit current: icc[a] supply voltage: vcc[v] tj = -40 c tj = 25 c tj = 125 c 0 10 20 30 40 50 60 70 80 90 100 012345678910 circuit current: icc[a] supply voltage: vcc[v] tj = -40 c tj = 25 c tj = 125 c typical performance curves bd433m2wefj-c / bd433m2efj-c / bd433m2wfp3-c / bd433m2fp3-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, ctl = 5 v (*1), iout = 0 ma. *1 applicable for product with enable input. figure 5. circuit current vs. power supply voltage figure 6. output voltage vs. power supply voltage (iout = 0 ma) figure 7. circuit current vs. power supply voltage *magnified figure 5. at low supply voltage figure 8. output voltage vs. power supply voltage (iout = 0 ma) *magnified figure 6. at low supply voltage 0 1 2 3 4 5 6 0 5 10 15 20 25 30 35 40 45 output voltage: vout[v] supply voltage: vcc[v] tj = -40 c tj = 25 c tj = 125 c 0 1 2 3 4 5 6 0123456 output voltage: vout[v] supply voltage: vcc[v] tj = -40 c tj = 25 c tj = 125 c downloaded from: http:///
datasheet datasheet 11/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series 0 1 2 3 4 5 6 0 100 200 300 400 500 600 700 output voltage: vout[v] output current: iout[m a] tj = -40 c tj = 25 c tj = 125 c typical performance curves bd433m2wefj-c / bd433m2efj-c / bd433m2wfp3-c / bd433m2fp3-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, ctl = 5 v (*1), iout = 0 ma. *1 applicable for product with enable input. figure10. output voltage vs. output current (over current protection) figure 9. output voltage vs. power supply voltage (iout = 10 ma) figure 11. dropout voltage (vcc = 3.135 v) figure 12. ripple rejection (ein = 1 vrms, iout = 100 ma) 0 1 2 3 4 5 6 0 5 10 15 20 25 30 35 40 45 output voltage: vout[v] supply voltage: vcc[v] tj = -40 c tj = 25 c tj = 125 c 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 20 40 60 80 100 120 140 160 180 200 dropout voltage: vd[v] output current: iout[m a] tj = -40 c tj = 25 c tj = 125 c 0 10 20 30 40 50 60 70 80 90 0.01 0.1 1 10 100 repple rejection: r.r.[db] frequency: f [khz] tj = -40 c tj = 25 c tj = 125 c downloaded from: http:///
datasheet datasheet 12/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series 0 10 20 30 40 50 60 70 80 90 0 40 80 120 160 200 circuit current: icc[a] output current: iout[m a] tj = -40 c tj = 25 c tj = 125 c 0 10 20 30 40 50 60 70 80 90 100 -40-20 0 20406080100120140160 circuit current: icc[a] junction temperature: tj[c] typical performance curves bd433m2wefj-c / bd433m2efj-c / bd433m2wfp3-c / bd433m2fp3-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, ctl = 5 v (*1), iout = 0 ma. *1 applicable for product with enable input. figure 13. circuit current vs. output current figure 14. output voltage vs. temperature (thermal shut down) figure 15. output voltage vs. temperature figure 16. circuit current vs. temperature 0 1 2 3 4 5 6 1 0 01 2 01 4 01 6 01 8 02 0 0 output voltage: vout[v] junction temperature: tj[c] 3.230 3.250 3.270 3.290 3.310 3.330 3.350 3.370 -40 0 40 80 120 160 output voltage: vout[v] junction temperature: tj[c] downloaded from: http:///
datasheet datasheet 13/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series typical performance curves bd433m2wefj-c / bd433m2wfp3-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, iout = 0 ma figure 17. shut down current vs. power supply voltage (ctl = 0 v) figure 18. ctl on / off mode voltage (tj = -40 c) figure 19. ctl on / off mode voltage (tj = 25 c) figure 20. ctl on / off mode voltage (tj = 125 c) 0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 35 40 45 shutdown current: ishut[a] supply voltage: vcc[v] tj = -40 c tj = 25 c tj = 125 c 0 1 2 3 4 5 6 012345 output voltage: vout[v] ctl supply voltage: ctl[v] tj = -40 c 0 1 2 3 4 5 6 012345 output voltage: vout[v] ctl supply voltage: ctl[v] tj = 25 c 0 1 2 3 4 5 6 012345 output voltage: vout[v] ctl supply voltage: ctl[v] tj = 125 c downloaded from: http:///
datasheet datasheet 14/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series 0 5 10 15 20 25 30 012345 ctl bias current: ictl[a] ctl supply voltage: ctl[v] tj = -40 c tj = 25 c tj = 125 c typical performance curves bd433m2wefj-c / bd433m2wfp3-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, iout = 0 ma figure 21. shut down current vs. temperature (ctl = 0 v) figure 22. ctl bias current vs. ctl supply voltage 0 1 2 3 4 5 -40 0 40 80 120 160 shutdown current: ishut[a] junction temperature: tj[c] downloaded from: http:///
datasheet datasheet 15/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40 45 circuit current: icc[a] supply voltage: vcc[v] tj = -40 c tj = 25 c tj = 125 c 0 10 20 30 40 50 60 70 80 90 100 012345678910 circuit current: icc[a] supply voltage: vcc[v] tj = -40 c tj = 25 c tj = 125 c typical performance curves bd450m2wefj-c / bd450m2efj-c / bd450m2wfp3-c / bd450m2fp3-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, ctl = 5v (*1), iout = 0 ma *1 applicable for product with enable input. figure 23. circuit current vs. power supply voltage figure 24. output voltage vs. power supply voltage (iout = 0 ma) figure 25. circuit current vs. power supply voltage *magnified figure 23. at low supply voltage figure 26. output voltage vs. power supply voltage (iout = 0 ma) *magnified figure 24. at low supply voltage 0 1 2 3 4 5 6 0 5 10 15 20 25 30 35 40 45 output voltage: vout[v] supply voltage: vcc[v] tj = -40 c tj = 25 c tj = 125 c 0 1 2 3 4 5 6 0123456 output voltage: vout[v] supply voltage: vcc[v] tj = -40 c tj = 25 c tj = 125 c downloaded from: http:///
datasheet datasheet 16/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series 0 1 2 3 4 5 6 0 100200300400500600700 output voltage: vout[v] output current: iout: [m a] tj = -40 c tj = 25 c tj = 125 c 0 10 20 30 40 50 60 70 80 90 0.01 0.1 1 10 100 repple rejection: r.r.[db] frequwncy: f [khz] tj = -40 c tj = 25 c tj = 125 c typical performance curves bd450m2wefj-c / bd450m2efj-c / bd450m2wfp3-c / bd450m2fp3-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, ctl = 5v (*1), iout = 0 ma *1 applicable for product with enable input. figure 28. output voltage vs. output current (over current protection) figure 27. output voltage vs. power supply voltage (iout = 10 ma) figure 29. dropout voltage (vcc = 4.75 v) figure 30. ripple rejection (ein = 1 vrms, iout = 100 ma) 0 1 2 3 4 5 6 0 5 10 15 20 25 30 35 40 45 output voltage: vout[v] supply voltage: vcc[v] tj = -40 c tj = 25 c tj = 125 c 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 20406080100120140160180200 dropout voltage: vd[v] output current: iout[m a] tj = -40 c tj = 25 c tj = 125 c downloaded from: http:///
datasheet datasheet 17/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series 0 10 20 30 40 50 60 70 80 90 0 40 80 120 160 200 circuit current: icc[a] output current: iout[m a] tj = -40 c tj = 25 c tj = 125 c 0 10 20 30 40 50 60 70 80 90 100 -40-20 0 20406080100120140160 circuit current: icc[a] junction temperature: tj[c] typical performance curves bd450m2wefj-c / bd450m2efj-c / bd450m2wfp3-c / bd450m2fp3-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, ctl = 5v (*1), iout = 0 ma *1 applicable for product with enable input. figure 31. circuit current vs. output current figure 32. output voltage vs. temperature (thermal shut down) figure 33. output voltage vs. temperature figure 34. circuit current vs. temperature 0 1 2 3 4 5 6 1 0 01 2 01 4 01 6 01 8 02 0 0 output voltage: vout[v] junction temperature: tj[c] 4.900 4.920 4.940 4.960 4.980 5.000 5.020 5.040 5.060 5.080 5.100 -40-20 0 20406080100120140160 output voltage: vout[v] junction temperature: tj[ ] downloaded from: http:///
datasheet datasheet 18/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series typical performance curves bd450m2wefj-c / bd450m2wfp3-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, iout = 0 ma figure 35. shut down current vs. power supply voltage (ctl = 0 v) figure 36. ctl on / off mode voltage (tj = -40 c) figure 37. ctl on / off mode voltage (tj = 25 c) figure 38. ctl on / off mode voltage (tj = 125 c) 0 1 2 3 4 5 6 012345 output voltage: vout[v] ctl supply voltage: ctl[v] tj = 125 c 0 1 2 3 4 5 6 012345 output voltage: vout[v] ctl supply voltage: ctl[v] tj = 25 c 0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 35 40 45 shutdown current: ishut[a] supply voltage: vcc[v] tj = -40 c tj = 25 c tj = 125 c 0 1 2 3 4 5 6 012345 output voltage: vout[v] ctl supply voltage: ctl[v] tj = -40 c downloaded from: http:///
datasheet datasheet 19/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series 0 5 10 15 20 25 30 012345 ctl bias current: ictl[a] ctl supply voltage: ctl[v] tj = -40 c tj = 25 c tj = 125 c typical performance curves bd450m2wefj-c / bd450m2wfp3-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, iout = 0 ma figure 39. shut down current vs. temperature (ctl = 0 v) figure 40. ctl bias current vs. ctl supply voltage 0 1 2 3 4 5 -40 0 40 80 120 160 shutdown current: ishut[a] junction temperature: tj[c] downloaded from: http:///
datasheet datasheet 20/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series measurement circuit for typical performance curves (bd433 / 450m2wefj-c) measurement setup for figure 5, 7, 16, 17, 21, figure 23, 25, 34, 35, 39 measurement setup for figure 6, 8, 14, 15, figure 24, 26, 32, 33 measurement setup for figure 10, 28 measurement setup for figure 11, 29 measurement setup for figure 12, 30 measurement setup for figure 13, 31 measurement setup for figure 18, 19, 20, figure 36, 37, 38 measurement setup for figure 22, 40 4.7f 10f bd4xxm2wefj-c 8:vcc 7:ctl 6:n.c. 5:gnd 1:vout 2:n.c. 3:n.c. 4:n.c. 4.7f 10f iout 8:vcc 1:vout bd4xxm2wefj-c 7:ctl 6:n.c. 5:gnd 2:n.c. 3:n.c. 4:n.c. 4.7f 10f bd4xxm2wefj-c 8:vcc 7:ctl 6:n.c. 5:gnd 1:vout 2:n.c. 3:n.c. 4:n.c. iout 4.7f 10f bd4xxm2wefj-c 8:vcc 7:ctl 6:n.c. 5:gnd 1:vout 2:n.c. 3:n.c. 4:n.c. iout measurement setup for figure 9, 27 downloaded from: http:///
datasheet datasheet 21/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series 4.7f 10f bd4xxm2efj-c 8:vcc 7:n.c. 6:n.c. 5:gnd 1:vout 2:n.c. 3:n.c. 4:n.c. iout measurement circuit for typical performance curves (bd433 / 450m2efj-c) measurement setup for figure 5, 7, 16, figure 23, 25, 34 measurement setup for figure 6, 8, 14, 15, figure 24, 26, 32, 33 measurement setup for figure 10, 28 measurement setup for figure 11, 29 measurement setup for figure 12, 30 measurement setup for figure 13, 31 4.7f 10f bd4xxm2efj-c 8:vcc 7:n.c. 6:n.c. 5:gnd 1:vout 2:n.c. 3:n.c. 4:n.c. 4.7f 10f bd4xxm2efj-c 8:vcc 7:n.c. 6:n.c. 5:gnd 1:vout 2:n.c. 3:n.c. 4:n.c. 1vrms iout measurement setup for figure 9, 27 downloaded from: http:///
datasheet datasheet 22/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series measurement setup for figure 22, 40 measurement setup for figure 9, 27 measurement setup for figure 11, 29 measurement setup for figure 13, 31 measurement circuit for typical performance curves (bd433 / 450m2wfp3-c) measurement setup for figure 18, 19, 20, figure 36, 37, 38 measurement setup for figure 5, 7, 16, 17, 21, figure 23, 25, 34, 35, 39 measurement setup for figure 6, 8, 14, 15, figure 24, 26, 32, 33 measurement setup for figure 12, 30 4.7f 10f 1:vcc 2:ctl 3:vout 4:gnd bd4xxm2wfp3-c 4.7f 10f 1:vcc 2:ctl 3:vout 4:gnd bd4xxm2wfp3-c iout 10uf 4.7uf 1:vcc 2:ctl 3:vout 4:gnd bd4xxm2wfp3-c 10f 4.7f 1:vcc 2:ctl 3:vout 4:gnd bd4xxm2wfp3-c iout iout 4.7f 1:vcc 2:ctl 3:vout 4:gnd bd4xxm2wfp3-c 4.7f 10f 1:vcc 2:ctl 3:vout 4:gnd bd4xxm2wfp3-c 4.7f 10f 1:vcc 2:ctl 3:vout 4:gnd bd4xxm2wfp3-c measurement setup for figure 10, 28 downloaded from: http:///
datasheet datasheet 23/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series measurement setup for figure 6, 8, 14, 15, figure 24, 26, 32, 33 measurement setup for figure 11, 29 measurement circuit for typical performance curves (bd433 / 450m2fp3-c) measurement setup for figure 5, 7, 16, figure 23, 25, 34 measurement setup for figure 9, 27 measurement setup for figure 12, 30 measurement setup for figure 13, 31 4.7uf 10uf 1:vcc 2:gnd 3:vout 4:gnd bd4xxm2fp3-c iout measurement setup for figure 10, 28 4.7uf 10uf 1:vcc 2:gnd 3:vout 4:gnd bd4xxm2fp3-c iout 4.7uf 1vrms 1:vcc 2:gnd 3:vout 4:gnd bd4xxm2fp3-c 10uf downloaded from: http:///
datasheet datasheet 24/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series selection of components externally connected ? vcc pin insert capacitors with a capacitance of 0.1 f or higher between the vcc and gnd pin. choose the capacitance according to the line between the power smoothing circuit and the vcc pin. selection of the capacitance also depends on the application. verify the application and allo w sufficient margins in the design. we recommend using a capacitor with excellent voltage and temperature characteristics. ? output pin capacitor in order to prevent oscillation, a capacitor needs to be placed between the output pin and gnd pin. we recommend using a capacitor with a capacitance of 10 f (typ.) or higher. electrolytic, tant alum and ceramic capacitors can be used. when selecting the capacitor en sure that the c apacitance of 6 f or higher is maintained at the intended applied voltage and temperature range. due to changes in temperature the capacitors capacitance can fluctuate possibly resulting in oscillation. for selection of the capacitor refer to the data of figure 41. the stable operation range given in the data of figure 41 is based on the standalone ic and resistive load. for actual applications the stable operating range is influenced by the pcb impedance, input supply impedance and load impedance. therefore verification of t he final operating environment is needed. when selecting a ceramic type capacitor, we recommend us ing x5r, x7r or better with excellent temperature and dc-biasing characteristics and high voltage tolerance. also, in case of rapidly changing input voltage and load cu rrent, select the capacitance in accordance with verifying that the actual applicat ion meets with the required specification. figure 41. esr vs. iout figure 42. cout vs. iout measurement setup figure 43. measurement setups for esr reference data (about output pin capacitor) unstable operation range stable operation range stable operation range unstable operation range condition vcc = 13.5 v (ctl = 5 v) cin = 0.1 f 10 f cout (typ.) -40 c tj +150 c condition vcc = 13.5 v (ctl = 5 v) cin = 0.1 f -40 c tj +150 c cin bd4xxm2wefj-c 8:vcc 7:ctl 6:n.c. 5:gnd 1:vout 2:n.c. 3:n.c. 4:n.c. cout iout esr cin bd4xxm2efj-c 8:vcc 7:n.c. 6:n.c. 5:gnd 1:vout 2:n.c. 3:n.c. 4:n.c. cout iout esr cin cout esr iout 1:vcc 2:gnd 3:vout 4:gnd bd4xxm2fp3-c i i : : : : xx- downloaded from: http:///
datasheet datasheet 25/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series 1.5 w 0.6 w 0 1 2 3 4 5 0 2 55 07 51 0 01 2 51 5 0 power dissipation: pd[w] ambient temperature: ta[c] power dissipation htsop-j8 figure 44. package data (htsop-j8) sot223-4f figure 45. package data (sot223-4f) ic mounted on rohm standard board based on jedec. board material: fr4 board size: 114.3 mm x 76.2 mm x 1.6 mmt (with thermal via on the board) mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2 mm x 74.2 mm) condition : ja = 166.7 c/w, jc (top) = 45 c/w condition : ja = 43.1 c/w, jc (top) = 16 c/w, jc (bottom) = 10 c/w ic mounted o n rohm standard board based on jedec. board material: fr4 board size: 114.3 mm x 76.2 mm x 1.6 mmt (with thermal via on the board) mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2 mm x 74.2 mm) condition : ja = 208.3 c/w, jc (top) = 52 c/w condition : ja = 83.3 c/w, jc (top) = 36 c/w, jc (bottom) = 17 c/w 0 1 2 3 4 5 0 2 55 07 51 0 01 2 51 5 0 power dissipation: pd[w] ambient temperature: ta[ ? ] 0.75 w 2.9 w downloaded from: http:///
datasheet datasheet 26/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series refer to the heat mitigation characteristics illustrated in figure 44, 45 when using the ic in an environment of ta 25 c. the characteristics of the ic are greatly influenced by t he operating temperature, and it is necessary to operate under the maximum junction temperature tjmax. even if the ambient temperature ta is at 25 c it is possible that the junction temperature tj reaches high temperatures. therefore, the ic should be operated within the power dissipation range. the following method is used to calculate the power consumption pc (w) pc = ( vcc - vout ) x iout + vcc x icc power dissipation pd pc the load current iout is obtained by operating the ic within the power dissipation range. (refer to figure 13, 31 for the icc.) thus, the maximum load current ioutmax for the applied voltage vcc can be calculated during the thermal design process. the following method is also used to calculate the junction temperature tj. htsop-j8 calculation example 1) with ta = 105 c vcc = 13.5 v, vout = 5.0 v at ta = 105 c with figure 44 condition, the calculation show s that 125 ma of output current is possible at 8.5 v potential difference across input and output. the thermal calculation shown above should be taken into c onsideration during the thermal design in order to keep the whole operating temperature range within the power dissipation range. in the event of shorting (i.e. vout and gnd pins are shorted) the power consumption pc of the ic can be calculated as follows: pc = vcc x ( icc + ishort ) ( refer to figure 10, 28 for the ishort ) ishort : short current calculation example 2) with tc(bottom) = 80 c , vcc = 13.5 v, vout = 5.0 v, iout = 80 ma at tc(bottom) = 80 c with figure 44 condition, the power consumption pc of the ic can be calculated as follows: pc = ( vcc - vout ) x iout + vcc x icc pc = ( 13.5 v - 5.0 v ) x 80 ma + 13.5 v x icc pc = 0.681 w ( icc = 45 a ) at the power consumption pc is 0.681 w, the junc tion temperature tj can be calculated as follows: tj = pc x jc + tc tj = 0.681 w x jc + 80 c tj = 86.8 c ( jc (bottom) = 10 c/w ) the junction temperature is 86 .8 c, at above condition. the thermal calculation shown above should be taken into c onsideration during the thermal design in order to keep the whole operating temperature range within tj 150 c. vcc : input voltage vout : output voltage iout : load current icc : circuit current pc : power consumption ic stand alone ja = 43.1 c/w -23 mw/c 25 c = 2.9 w 105 c = 1.06 w iout 1.06 w - 13.5 v x icc 8.5 v iout 125 ma ( icc: 45 a ) tj = pc x jc + tc ta : ambient temperature tc : case temperature tj : junction temperature jc : thermal resistance (junction to case) iout pd - vcc x icc vcc - vout downloaded from: http:///
datasheet datasheet 27/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series sot223-4f calculation example 1) with ta = 105 c vcc = 13.5 v, vout = 5.0 v at ta = 105c with figure 45 condition, the calculation shows that 63 ma of output current is possi ble at 8.5 v potential difference across input and output. the thermal calculation shown above should be taken into c onsideration during the thermal design in order to keep the whole operating temperature range within the power dissipation range. in the event of shorting (i.e. vout and gnd pins are shorted) the power consumption pc of the ic can be calculated as follows: pc = vcc x ( icc + ishort ) ( refer to figure 10, 28 for the ishort ) calculation example 2) with tc(bottom) = 92 c , vcc = 13.5 v, vout = 5.0 v, iout = 80 ma at tc(bottom) = 92 c with figure 45 condition, the power consumption pc of the ic can be calculated as follows: pc = ( vcc - vout ) x iout + vcc x icc pc = ( 13.5 v - 5.0 v ) x 80 ma + 13.5 v x icc pc = 0.681 w ( icc = 45 a ) at the power consumption pc is 0.681 w, the junction temperatur e tj can be calculated as follows: tj = pc x jc + tc tj = 0.681 w x jc + 92 c tj = 103.6 c ( jc (bottom) = 17 c/w ) the junction temperature is 103.6 c, at above condition. the thermal calculation shown above should be taken in to consideration during the thermal design in order to keep the whole operating temperature range within tj 150 c. ic stand alone ja = 83.3 c/w -12 mw/c 25 c = 1.50 w 105 c = 0.54 w iout 0.54 w - 13.5 v x icc 8.5 v iout 63 ma ( icc: 45 a ) downloaded from: http:///
datasheet datasheet 28/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series application examples ? applying positive surge to the vcc pin if the possibility exists that surges higher than 45 v will be applied to the vcc pin, a zener diode should be placed between the vcc pin and gnd pin as shown in the figure below. figure 46. sample application circuit 1 ? applying negative surge to the vcc pin if the possibility exists that negative surges lower than the gnd are applied to the vcc pin, a shottky diode should be place between the vcc pin and gnd pin as shown in the figure below. figure 47. sample application circuit 2 ? implementing a protection diode if the possibility exists that a large inductive load is connec ted to the output pin result ing in back-emf at time of startup and shutdown, a protection diode should be placed as shown in the figure below. figure 48. sample application circuit 3 i / o equivalence circuit (applicable for product with enable input) figure 49. input / output equivalence circuit htsop-j8 sot223-4f vcc vout 4 m ? (typ.) 1545 k ? (typ./5.0 v output) 530 k ? (typ.) 840 k ? (typ./3.3 v output) vout htsop-j8 sot223-4f 4:gnd 2:ctl 3:vout 1:vcc bd4xxm2wfp3-c cin cout input switch vout battery zener diode 4:gnd 2:gnd 3:vout 1:vcc bd4xxm2fp3-c cin cout vout battery zener diode 4:gnd 2:ctl 3:vout 1:vcc bd4xxm2wfp3-c cin cout input switch vout battery shottky diode 4:gnd 2:gnd 3:vout 1:vcc bd4xxm2fp3-c cin cout vout battery shottky diode downloaded from: http:///
datasheet datasheet 29/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series operational notes 1) absolute ma ximum ratings exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in damages to or destruction of the chip. in this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc.). therefore, if any special mode is being considered with values expected to exceed the absolute maximum ratings, implementin g physical safety measures, such as adding fuses, should be considered. 2) the electrical characteristics given in this specification may be influenced by conditions such as temperature, supply voltage and external components. transient characteristics should be sufficiently verified. 3) gnd electric potential keep the gnd pin potential at the lowest (minimum) level under any operating condition. furthermore, ensure that, including the transient, none of the pins voltages are less than the gnd pin voltage. 4) gnd wiring pattern when both a small-signal gnd and a high current gnd are present, single- point grounding (at the set standard point) is recommended. this in order to separate the small-signal and high current patterns and to ensure that voltage changes stemming from the wiring resistance and high current do not cause any voltage change in the small-signal gnd. similarly, care must be taken to avoi d wiring pattern fluctuations in any connected external component gnd. 5) inter-pin shorting and mounting errors ensure that when mounting the ic on the pcb the direction and position are correct. incorrect mounting may result in damaging the ic. also, shorts caused by dust enterin g between the output, input and gnd pin may result in damaging the ic. 6) inspection using the set board the ic needs to be discharged after each inspection process as, while using the set board for inspection, connecting a capacitor to a low-impedance pin may cause stress to the ic. as a protection from static electricity, ensure that the assembly setup is grounded and take sufficient caution with transportation and storage. also, make sure to turn off the power supply when connecting and disconnecting the inspection equipment. 7) power dissipation (pd) should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 114.3mm x 76. 2mm x 1.6mmt glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copp er area to prevent exceeding the pd rating. 8) thermal design the power dissipation under actual op erating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. on the reve rse side of the package this product has an exposed heat pad for improving the heat dissipation. use both the fron t and reverse side of the pcb to increase the heat dissipation pattern as far as possible. the amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. therefore, w hen actually using the chip, ensure that the generated heat does not exceed the pd rating. tjmax: maximum junction temperature = 150c, ta: ambient temperature (c), ja: junction-to-ambient thermal resistance (c/w), pd: power dissipation rating (w), pc: power consumption (w), vcc: supply voltage, vout: output voltage, iout: output current, icc: circuit current power dissipation rating pd (w) = ( tjmax - ta ) / ja power consumption pc (w) = ( vcc - vout ) x iout + vcc x icc 9) overcurrent protection circuit this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 10) thermal shut down (tsd) this ic incorporates and integrated thermal shutdown circ uit to prevent heat damage to the ic. normal operation should be within the power dissipation rating, if however the rating is exceeded for a c ontinued period, the junction temperature (tj) will rise and the tsd circuit will be activate d and turn all output pins off. after the tj falls below the tsd threshold the circuits are automatic ally restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. downloaded from: http:///
datasheet datasheet 30/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series 11) in some applications, the vcc and pi n potential might be reversed, possibly resu lting in circuit internal damage or damage to the elements. for example, while the external capacitor is charged, the vcc shorts to the gnd. use a capacitor with a capacitance with less than 1000 f. we also recommend using reverse polarity diodes in series or a bypass between all pins and the vcc pin. figure 50. 12) this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p/n junctions are formed at the intersection of these p layers with the n layers of other elements to create a variety of parasitic elements. for example, in case a resistor and a transistor are c onnected to the pins as shown in the figure below then: the p/n junction functions as a parasitic diode when gnd > pi n a for the resistor, or gnd > pin b for the transistor. also, when gnd > pin b for the transistor (npn), the para sitic diode described above combines with the n layer of the other adjacent elements to operat e as a parasitic npn transistor. parasitic diodes inevitably occur in the structure of the ic. their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. therefore do not employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the (p substrate) gnd. figure 51. vcc vout gnd bypass diode reverse polarity diode downloaded from: http:///
datasheet datasheet 31/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series physical dimension, tape and reel information (htsop-j8) package name htsop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet datasheet 32/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series physical dimension, tape and reel information (sot223-4f) package name sot223-4f downloaded from: http:///
datasheet datasheet 33/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series marking diagrams (top view) part number marking output voltage [v] enable input *1 part number marking output voltage [v] enable input *1 433m2w 3.3 433m2w 3.3 450m2w 5.0 450m2w 5.0 433m2 3.3 433m2 3.3 450m2 5.0 450m2 5.0 *1 : includes enable input : not includes enable input *1 : includes enable input : not includes enable input htsop-j8 (top view) 1pin mark lot number part number marking sot223-4f (top view) part number marking lot number 1pin downloaded from: http:///
datasheet datasheet 34/34 tsz02201-0t2t0an00040-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.oct.2013 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm2-c series revision history date revision changes 05.dec.2012 001 new release (bd450m2wefj-c, bd450m2efj-c) 15.jan.2013 002 additional entry (bd4xxm2-c series) 29.oct.2013 003 p.1 , p.3 figure 3, p.4, p.5 figure 4, p.9, p.13, p23, p.24, p.26, p.29, p.30 improve the explanation and corrected type. p.28, p.30 improve the correct figure nu mber because of sequence. before) figure 48, 49, 50, 51, 52, 53. after) figure 46, 47, 48, 49, 50, 51. downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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